M3 Initial designs and parameters for mechanically active elements
lead: MPI
due in month 12 (done)
description: Set of initial designs for the microfluidic active elements (D2.1).
M4 Capacity to deposit materials in well-defined morphologies and coupling with chip structural materials leading to fluidic and sensing functions
lead: CSIC
due in month 36
description: Actuating and sensing materials deposited with well-defined morphologies and integrated with chip structural materials.
M5 Capacity to integrate fluidic and sensing elements in a device
lead: CSIC
due in month 36
description: Fluidic and sensing elements integrated in a device.